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                                       Details for article 17 of 25 found articles
 
 
  Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms
 
 
Title: Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms
Author: Zehe, A.
Appeared in: Microelectronics reliability
Paging: Volume 42 (2002) nr. 12 pages 7 p.
Year: 2002
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 17 of 25 found articles
 
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