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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 2 of 16 found articles
| Title: |
Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability |
| Author: |
Stepniak, Frank |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 41 (2001) nr. 5 pages 10 p. |
| Year: |
2001 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 16 found articles
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