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                                       Details for article 15 of 19 found articles
 
 
  Reliability aspects of thermal micro-structures implemented on industrial 0.8 μm CMOS chips
 
 
Title: Reliability aspects of thermal micro-structures implemented on industrial 0.8 μm CMOS chips
Author: Sheng, L.Y
De Tandt, C
Ranson, W
Vounckx, R
Appeared in: Microelectronics reliability
Paging: Volume 41 (2001) nr. 2 pages 9 p.
Year: 2001
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 15 of 19 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands