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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 64 of 87 found articles
| Title: |
Reliability of flip chip and chip size packages |
| Author: |
Reichl, H. Schubert, A. Töpper, M. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 40 (2000) nr. 8-10 pages 12 p. |
| Year: |
2000 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 64 of 87 found articles
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