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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 8 of 19 found articles
| Title: |
Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies |
| Author: |
Okura, J.H Shetty, S Ramakrishnan, B Dasgupta, A Caers, J.F.J.M Reinikainen, T |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 40 (2000) nr. 7 pages 8 p. |
| Year: |
2000 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 19 found articles
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