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Journal description
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Details for article 1 of 20 found articles
| Title: |
A grain structure based statistical simulation of electromigration damage in chip level interconnect lines |
| Author: |
Korhonen, T.M. Brown, D.D. Korhonen, M.A. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 40 (2000) nr. 12 pages 8 p. |
| Year: |
2000 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 20 found articles
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