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  An attempt to explain thermally induced soft failures during low level ESD stresses: study of the differences between soft and hard NMOS failures
 
 
Title: An attempt to explain thermally induced soft failures during low level ESD stresses: study of the differences between soft and hard NMOS failures
Author: Salome, P.
Leroux, C.
Mariolle, D.
Lafond, D.
Chante, J.P.
Crevel, P.
Reimbold, G.
Appeared in: Microelectronics reliability
Paging: Volume 38 (1998) nr. 11 pages 10 p.
Year: 1998
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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