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Journal description
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Details for article 10 of 87 found articles
| Title: |
An on-wafer test structure to measure the effect of thermally-induced stress on silicon devices |
| Author: |
Haddab, Y. Manic, D. Popovic, R.S. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 37 (1997) nr. 10-11 pages 4 p. |
| Year: |
1997 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 87 found articles
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