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Journal description
All volumes of the corresponding journal
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Details for article 65 of 139 found articles
| Title: |
Experimental and analytical studies of encapsulated flip chip solder bumps on surface laminar circuit boards |
| Author: | |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 34 (1994) nr. 8 pages 1 p. |
| Year: |
1994 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 65 of 139 found articles
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