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Journal description
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Details for article 14 of 130 found articles
| Title: |
An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments |
| Author: | |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 33 (1993) nr. 9 pages 1 p. |
| Year: |
1993 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 130 found articles
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