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                                       Details for article 19 of 20 found articles
 
 
  The in-process bond shear test: Its relationship to ball bond reliability and its application to the reduction of wirebond process variation
 
 
Title: The in-process bond shear test: Its relationship to ball bond reliability and its application to the reduction of wirebond process variation
Author: Guzman, Melissa Shell-De
Mahaney, Michael
Strode, Richard
Appeared in: Microelectronics reliability
Paging: Volume 33 (1993) nr. 11-12 pages 12 p.
Year: 1993
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 19 of 20 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands