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Journal description
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Details for article 7 of 25 found articles
| Title: |
Electromigration behavior of multilayered Al/Hf and Al/Ti fine lines and its dependence on Cu and Pd solute additions |
| Author: |
Rodbell, K.P. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 32 (1992) nr. 11 pages 6 p. |
| Year: |
1992 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 25 found articles
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