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Journal description
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All issues of the corresponding volume
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Details for article 4 of 22 found articles
| Title: |
A study of failure of SMT solder joints under thermal cycles by statistics |
| Author: |
Huang, J.H. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 32 (1992) nr. 10 pages 4 p. |
| Year: |
1992 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 22 found articles
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