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Journal description
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Details for article 17 of 47 found articles
| Title: |
4965660 Integrated circuit package having heat sink bonded with resinous adhesive |
| Author: |
Ogihara, Satoru Kodama, Hironori Ushifusa, Nobuyuk Otsuka, Kanji |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 31 (1991) nr. 6 pages 1 p. |
| Year: |
1991 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 47 found articles
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