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Journal description
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Details for article 19 of 38 found articles
| Title: |
4493010 Electronic packaging module utilizing phase-chage conductive cooling |
| Author: | |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 25 (1985) nr. 5 pages 1 p. |
| Year: |
1985 |
| Contents: | |
| Publisher: |
Pergamon Press Ltd. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 38 found articles
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