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Journal description
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Details for article 159 of 178 found articles
| Title: |
Thermal stress analysis of composite encapsulants with a spherical adhesive interface |
| Author: |
Jordan, A.S Berkstresser, G.W |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 20 (1980) nr. 4 pages 5 p. |
| Year: |
1980 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 159 of 178 found articles
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