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Journal description
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Details for article 3 of 24 found articles
| Title: |
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods |
| Author: |
Karanja, L. Pichon, P. Legros, M. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 172 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 24 found articles
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