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Journal description
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Details for article 63 of 63 found articles
| Title: |
Wire bonding failure characterization of an IGBT based power module through impedance analysis |
| Author: |
Vidal, P.-E. Baffreau, S. Viné, G. Gopishetti, A. Long, T.L. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 168 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 63 of 63 found articles
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