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Journal description
All volumes of the corresponding journal
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Details for article 53 of 63 found articles
| Title: |
Stress–strain analysis and prediction of WLCSP solder joints under bending–torsion coupled loading |
| Author: |
Huang, Lixiang Huang, Chunyue Gao, Chao Liang, Ying |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 168 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 53 of 63 found articles
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