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Journal description
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Details for article 48 of 63 found articles
| Title: |
Risk of CuxO phase penetration between the Ag plating layer and Cu during high-temperature reliability testing of interfaces bonded to cold sintered Ag nano-porous sheets on direct Ag-plated Cu substrates |
| Author: |
Kim, YehRi Jo, Eunjin Ju, Byeong Kwon Lee, Yoongul Kim, Jaeup Ahn, Kijoon Noh, Seungjun Kim, Dongjin |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 168 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 48 of 63 found articles
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