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Journal description
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Details for article 26 of 63 found articles
| Title: |
Heterogeneity-induced thermal mismatch in BGA interconnects: Insights from mechanical-thermal finite element modeling |
| Author: |
Chu, Liu Shi, Jiajia Long, Xu |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 168 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 63 found articles
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