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Journal description
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Details for article 15 of 16 found articles
| Title: |
Simulation of intergranular crack extension at Cu/Al wire bonding interface |
| Author: |
Yao, Jingguang Zhou, Hongliang Cao, Jun Lu, Jicun Xu, Xiaoning Ming, Pingmei Wang, Ziming Persic, John |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 166 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 16 found articles
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