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Journal description
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Details for article 11 of 16 found articles
| Title: |
Investigation on FCBGA package with vertical-aligned carbon fiber thermal pad as thermal interface material |
| Author: |
Yi, Mingming Qiu, Yiou Wu, Ping Sun, Guoliao Zhu, Wenhui Wang, Liancheng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 166 () nr. C pages p. |
| Year: |
2025 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 16 found articles
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