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Journal description
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Details for article 23 of 26 found articles
| Title: |
Research on the multi-physical field coupling modelling of IGBT package module and the effect of different structure failure interaction |
| Author: |
Ren, Hanwen Zhao, Siyang Mu, Jian Wang, Wei Yu, Wanshui Wang, Feng Han, Zhiyun Li, Zhihui Li, Qingmin Wang, Jian |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 162 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 23 of 26 found articles
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