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Journal description
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Details for article 10 of 26 found articles
| Title: |
Effect of microstructural variability on fatigue simulations of solder joints |
| Author: |
Rebosolan, M. van Soestbergen, M. Zaal, J.J.M. Hauck, T. Dasgupta, A. Chen, B. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 162 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 26 found articles
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