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Journal description
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Details for article 3 of 10 found articles
| Title: |
Durability distribution prediction of thermo-mechanical solder fatigue failure with uncertainty propagation by eigenvector dimension reduction method |
| Author: |
Huang, Chien-Ming Herrmann, Jeffrey W. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 161 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 10 found articles
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