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Journal description
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Details for article 19 of 19 found articles
| Title: |
Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module |
| Author: |
Lee, Hyun Suk Yun, Giseok Song, Ju-Hwan Kim, Do-Nyun |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 160 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 19 found articles
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