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                                       Details for article 14 of 17 found articles
 
 
  Solvent-free Cu sintering pastes using acidic activators
 
 
Title: Solvent-free Cu sintering pastes using acidic activators
Author: Han, Seong-ju
Park, Gun-woo
Jang, Keon-Soo
Appeared in: Microelectronics reliability
Paging: Volume 159 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 14 of 17 found articles
 
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