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Journal description
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Details for article 7 of 7 found articles
| Title: |
Synergistic enhancement of adhesion and electromigration reliability of cobalt via super-diluted (0.06 at.%) tungsten alloying as next-generation interconnect materials |
| Author: |
Fang, Jau-Shiung Su, Ting-Hsun Cheng, Yi-Lung Chen, Giin-Shan |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 158 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 7 found articles
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