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Journal description
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Details for article 3 of 7 found articles
| Title: |
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC |
| Author: |
Song, Renhao Zhang, Junqin Zhu, Zhanqi Shan, Guangbao Yang, Yintang |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 158 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 7 found articles
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