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Journal description
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Details for article 1 of 10 found articles
| Title: |
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages |
| Author: |
Kilian, Borja Gleichauf, Jonas Maniar, Youssef Wittler, Olaf Schneider-Ramelow, Martin |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 156 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 10 found articles
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