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                                       Details for article 16 of 19 found articles
 
 
  Solder fatigue life modeling of QFN components based on design of experiments
 
 
Title: Solder fatigue life modeling of QFN components based on design of experiments
Author: Käß, Markus
Schmidt, Hendrik
Hülsebrock, Moritz
Lichtinger, Roland
Bein, Thilo
Appeared in: Microelectronics reliability
Paging: Volume 152 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 16 of 19 found articles
 
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