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Journal description
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Details for article 21 of 136 found articles
| Title: |
Application of thermal analysis to the semiconductor plastic package thermal shock testing reliability |
| Author: |
Ritchie, Kim |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 15 (1976) nr. 5 pages 2 p. |
| Year: |
1976 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 136 found articles
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