|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 12 of 13 found articles
| Title: |
Multi-physics coupling analysis of high-power IGBT module bonding wires fault considering stray inductance of main circuit |
| Author: |
Wang, Yue Rong, Xiang Yang, Chaoxu Shi, Han Zheng, Jiayu |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 149 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 13 found articles
| << previous | next >> |