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                                       Details for article 14 of 37 found articles
 
 
  Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints
 
 
Title: Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints
Author: Sabbar, Ehsan H.
Al-Zubaidi, Hazim A.
Aljumaili, Amer K.
Al-Jumaili, Mustafa H.
Al-Jumaili, Ahmed I.
Alsheakh, Hussein
Appeared in: Microelectronics reliability
Paging: Volume 147 () nr. C pages p.
Year: 2023
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 14 of 37 found articles
 
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