|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 4 of 18 found articles
| Title: |
Effect of Bi content and aging on solder joint shear properties considering strain rate |
| Author: |
Belhadi, Mohamed El Amine Hamasha, Sa'd Alahmer, Ali |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 146 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 18 found articles
| << previous | next >> |