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Journal description
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Details for article 6 of 15 found articles
| Title: |
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder |
| Author: |
Xu, Fengxian Zhu, Wenjia Yan, Jikang Zhao, Lingyan Lv, Jinmei |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 140 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 15 found articles
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