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                                       Details for article 80 of 115 found articles
 
 
  Novel stress analysis method on board-level during drop tests for electrical components
 
 
Title: Novel stress analysis method on board-level during drop tests for electrical components
Author: Huotari, J.
Inkeri, T.
Appeared in: Microelectronics reliability
Paging: Volume 138 () nr. C pages p.
Year: 2022
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 80 of 115 found articles
 
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