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Journal description
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Details for article 30 of 115 found articles
| Title: |
Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer |
| Author: |
Jiang, H. Robertson, S. Liang, S. Zhou, Z. Zhao, L. Liu, C. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 138 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 30 of 115 found articles
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