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Journal description
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Details for article 108 of 115 found articles
| Title: |
Study of migration and coalescence of voids driven by electric current stressing in solder interconnects using phase field simulation |
| Author: |
Liang, S. Zhou, M.B. Ke, C.B. Wei, C. Zhang, X.P. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 138 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 108 of 115 found articles
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