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Journal description
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Details for article 21 of 27 found articles
| Title: |
Interdiffusion and formation of intermetallic compounds in high-temperature power electronics substrate joints fabricated by transient liquid phase bonding |
| Author: |
Imediegwu, Chidinma Graham, Samuel Pahinkar, Darshan G. Narumanchi, Sreekant Paret, Paul Major, Joshua |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 137 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 27 found articles
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