|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 13 of 27 found articles
| Title: |
Failure mechanism of 4H-SiC junction barrier Schottky diodes under harsh thermal cycling stress |
| Author: |
Zhang, Yuan-Lan Zhang, Jie Ma, Hong-Ping Chi, Yan-Qing Tian, Hao-Ran Liu, Jian-Hua Liu, Qi-Bin Chen, Zhong-Guo Zhang, Qingchun Jon |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 136 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 27 found articles
| << previous | next >> |