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Details for article 26 of 34 found articles
| Title: |
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm |
| Author: |
Nashrudin, Muhammad Naqib Ng, Fei Chong Abas, Aizat Abdullah, Mohd. Zulkifly Ali, Mohd. Yusuf Tura Samsudin, Zambri |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 135 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 34 found articles
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