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Journal description
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Details for article 12 of 12 found articles
| Title: |
Surface action mechanism and design considerations for the mechanical integrity of cu/low K BEOL interconnect during chemical mechanical polishing process |
| Author: |
Wang, Shizhao Liu, TianJian Dong, Fang Sun, Yameng Xue, Lianghao Li, Rui Han, Xu Tian, Zhiqiang Liu, Sheng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 134 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 12 found articles
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