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Journal description
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Details for article 9 of 22 found articles
| Title: |
Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint |
| Author: |
Bai, Tianyue Qiao, Yuanyuan Wang, Xudong Zhao, Ning |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 129 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 9 of 22 found articles
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