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Details for article 7 of 22 found articles
| Title: |
Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad |
| Author: |
Kim, Jungsoo Park, Dae-Young Ahn, Byeongjin Bang, Junghwan Kim, Min-Su Park, Hyun-Soon Sohn, Yoonchul Ko, Yong-Ho |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 129 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 22 found articles
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