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                                       Details for article 5 of 22 found articles
 
 
  Development of solderable layer on power MOSFET for double-side bonding
 
 
Title: Development of solderable layer on power MOSFET for double-side bonding
Author: Kim, Dajung
Won, Mi So
Jang, Jeongki
Kim, Sooseong
Oh, Chulmin
Appeared in: Microelectronics reliability
Paging: Volume 129 () nr. C pages p.
Year: 2022
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 22 found articles
 
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