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Journal description
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Details for article 19 of 22 found articles
| Title: |
Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks |
| Author: |
Zippelius, Andreas Hanß, Alexander Schmid, Maximilian Pérez-Velázquez, Judith Elger, Gordon |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 129 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
The Authors |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 22 found articles
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