|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 34 of 111 found articles
| Title: |
Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging |
| Author: |
Roumanille, Pierre Ben Romdhane, Emna Pin, Samuel Nguyen, Patrick Delétage, Jean-Yves Guédon-Gracia, Alexandrine Frémont, Hélène |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 126 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 34 of 111 found articles
| << previous | next >> |