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Journal description
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Details for article 22 of 23 found articles
| Title: |
Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation |
| Author: |
Qin, Fei Zhao, Shuai Liu, Lingyun Dai, Yanwei An, Tong Chen, Pei Gong, Yanpeng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 124 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 22 of 23 found articles
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